Description:

Electronic Materials SUBA＆#8482; Polishing Pads offer significant advantages in achieving consistent, reproducible results in polishing semiconductor wafers, gl and ceramics. May also be used as a sub-pad.

Used in:

• Stock removal on silicon wafers
• Polishing fragile crystals or other delicate surfaces
• Polishing gl, quartz, ceramics, special metals, and plastic

Advantages:

• Range of gradients for stock, intermediate, final, and edge polishing of wafer substrates
• Reduced pad glazing and improved process control in wafer manufacturing
• Ideal for polishing a wide variety of materials
• All grades achieve high precision surfaces and consistent, reproducible results

Used in:

Advantages:

• In production of semiconductor devices.
• In tungsten, copper, ILD, STI, and polysilicon processes
• With leading rotary, orbital and belt CMP tools

• Industry standard pads for chemical mechanical planarization
• Localized planarization
• Excellent removal rates
• Low global non-uniformity and low defectivity
• Wide variety of diameters and shapes – compatible with leading-edge CMP tools
• End point detection available

Used in:

Advantages:

• Wafer polish in semiconductor manufacturing
• Final polish for silicon wafers

• Produce a featureless, exacting surface finish
• Developed through laboratory and customer testing
• Different combinations of pore structure, polymer te and substrate composition
• Work effectively under a wide variety of polishing conditions
• Permit maximum compatibility with individual processes

Used in:

Advantages:

Various CMP polishing processes including:

• Tungsten bulk removal
• Copper barrier removal
• Various buffing steps

• Industry standard for low-defectivity CMP polishing
• Available in Regular and Hi configurations for all standard CMP polishing tools
• End point detection available

Used in:

Advantages:

• Copper barrier processes
• Production of semiconductor devices

VisionPads＆#8482; have significant performance advantages over other pads in copper barrier processes:

• Retain peak performance throughout life of pad
• Higher wafer yields due to low defectivity results during volume production of copper wafers
• Superior chemical mechanical planarization performance
• Improved die yields through minimization of scratches across the wafer
• End point detection available